Air-cooled heat sinks are important parts of electronic components such as power semiconductor devices in drive train control units, in high-voltage supply systems and in control systems of medical equipment and locomotives. They eliminate heat loss of power semiconductors and other electronic components and thus assure reliable functioning. Efficient cooling with DAU heat sinks and heat pipes significantly increases the components’ service life.
Compared to other heat sinks, the manufacturing process of DAU bonded-fin heat sinks assures optimal and efficient heat dissipation. The basic plate consists of a highly heat-conducting extruded aluminum profile; the fins, made from pure aluminum, are bonded with a specially developed, highly heat-conducting adhesive. The adhesive used has a very high aluminum content, conducts heat similarly well as aluminum and enables good heat transmission between the basic plate and fins.
In addition, this manufacturing method enables much larger fin heights and smaller fin spacing than in conventional heat sinks. While the ratio is usually 10:1, DAU is able to achieve a fin height to fin spacing ratio of 30:1. With a same-sized basic plate, larger fin surfaces and, therefore, higher heat dissipation are possible. In other words, more heat dissipation is achieved in the same space.
This makes DAU an important development partner of the automotive, medical and energy industries. With its compact design and specifically adapted thermal solutions, the company significantly assists in making drive trains efficient.
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